During my study abroad trip to Tokyo, Japan, I had the opportunity to complete a packaging redesign project within a group. We took a Japanese-based project and redesigned it from an American perspective.
Throughout the trip abroad, we focused on the differences between American and Japanese cultures. We completed this research by taking many trips around town to see how things are different.
* This was a group project with one other industrial design peer
Reaserch
Then we continued to experiment with what shape that the packaging should be
Then we finished off the planning stage with graphical representations and creating a physical representation
Next, we prepared our presentation and models for a group critique with both American and Japanese students. We were able to gain advice on things we did well and things that might benefit from being changed
* The rest of the project was worked on individually
When I got back to the States, I continued to look around at different packaging designs and redesigned the front of the chip packaging.
Final Project
